Awards and Recognition:
September 2017 - Won Best Presentation in Packaging Reliability session for "Mechanistic Investigation and
Prevention of Corrosion in Copper Wire - Aluminum Bond Pad Assembly" at SRC Techcon 2017, Austin, United
May 2018 - Won the Best Graduate Student Research Presenter at the Third year mandatory Graduate
Student Seminar Competition conducted by Department of Chemistry, University of North Texas. Presentation
Title: "Aluminum Bond Pad Corrosion in Copper Wire Bonded Assembly - Defectivity characterization and
Prevention Strategy" & "Characterization of Supercritical Cleaning of Post-etch Fluoropolymer Residue by Chemical
Bonding Transformation Mapping."
October 2018 - Honor: The work "Explore High Bonding Reliability of Cu Wire Bonded Devices under Extreme
Halide Contaminated Environments" has been invited to be presented as a Workshop in the IMAPS 2018
Conference on Microelectronics.
Publications and Conferences:
Muthappan Asokan, Joshua Caperton, Ashish Salunke, Oliver Chyan, Fei Xu, "Explore High Bonding Reliability of
Cu Wire Bonded Devices under Extreme Halide Contaminated Environments"; IMAPS 2018 - Pasadena - 51st
Symposium on Microelectronics.
Muthappan Asokan, Josh Caperton, Zach Thompson, Oliver Chyan, Mahmud Chowdhury, Shawn O' Connor, Luu
Nguyen: "Novel Corrosion Prevention Treatments for Cu Wire Boned Device to Improve Bonding Reliability", 2018
IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, doi: 10.1109/ECTC.2018.00029